Technical capabilities
Complex boards.
Precise capabilities.
The expertise, processes and equipment to
assemble demanding electronics, from
prototypes to production.
Technical
capabilities.
Flexible electronic assembly services, with processes and equipment to support your requirements.
| Capability | Details |
|---|---|
| Assembly technologies | SMT, through-hole, press-fit, mixed technology |
| Component placement | Down to 01005 |
| BGA / CSP pitch | Down to 0.3 mm |
| Solder processes | Reflow, hand, selective, wave, dip, hot bar |
| Inspection | Multi-step inspection, SPI, AOI and X-ray |
| Test & rework | Flying probe, functional testing, BGA rework and reballing |
Precision equipment.
Experienced people.
Assembly, inspection and rework capabilities combined with hands-on attention to your project requirements.
Have a challenging assembly?
Talk with our team about your requirements and how we can help.